I am a Second-year PhD student at University of Edinburgh(UoE), UK. I got my Master degree from Eindhoven University of Technology(TU/e), Netherlands and my bachelor degree from Hefei University of Technology(HFUT), China. My research focuses on designing digital hardware acceleration systems for large-scale AI models using novel architectures, aiming to overcome memory and computational bottlenecks. My current focus is on advancing hardware accelerators for LLMs, VLMs, and generative AI to enable next-generation intelligent computing.

Here is my CV, and I am looking for possible research collaboration. If you are interested in me, please feel free to contact me at any time.

🔥 News

  • [2026.04]  🎉🎉 I present a poster and give a short 2 minute presentation about Towards Scalable GenAI Hardware Architectures with a Design Space Exploration Framework on School of Engineering Research Conference 2026.
  • [2026.03]  🎉🎉 I served as teaching assistant of Mini ASIC-BASIC Workshop and give a tutorial about Digital ASIC Flow in GF-22nm.
  • [2026.02]  🎉🎉 I finished my first tape-out Bent-Pyramid Systolic Array in TSMC-180nm and served as a demonstrator of Digital System Laboratory 4.
  • [2025.11]  🎉🎉 I attend course Advanced Node Digital IC Implementation of Europractice and got certficate.
  • [2025.10]  🎉🎉 I attend MeMRISYS 2025 as a volunteer in Edinburgh and served as a demonstrator of Digital System Laboratory 3.
  • [2025.09] [Conference] I present my work "LinkBo: a Single-Wire, Low-Latency, and Robust Protocol for Variable-Distance Chip-to-Chip Communications" on SOCC 2025 in Dubai, UAE.
  • [2025.07] [Paper] Our work "LinkBo: a Single-Wire, Low-Latency, and Robust Protocol for Variable-Distance Chip-to-Chip Communications" accepted to SOCC 2025 and selected as oral presentation.
  • [2025.01]  🎉🎉 I started my PhD study in University of Edinburgh, supervised by Dr. Shady Agwa and Professor Themis Prodromakis.
  • [2024.11]  🎉🎉 I finished my internship at NXP Semiconductors and successfully defenced my Master Thesis with 8.5/10 at TU/e. Committee member: Marc Geilen, Manil Dev Gomony and Chengmin Li.
  • [2024.09]  🎉🎉 I got a conditional PhD offer at the University of Edinburgh.
  • [2024.03]  🎉🎉 Congratulations Intrinsic ID is acquired by Synopsys.
  • [2024.03]  🎉🎉 I change my master thesis to NXP Semiconductors in Nijmegen, supervised by Kimmo Salo(NXP), Gustavo Naspolini(NXP).
  • [2023.11]  🎉🎉 I started working as a Oversea VC Intern(Remote) at Linear Capital.
  • [2023.10]  🎉🎉 I finished my internship at Intrinsic ID and got 8.5 of internship. I also start my research on Neuromorphic at TU/e.
  • [2023.07]  🎉🎉 I will be an intern at Intrinsic ID for 3.5 months, supervised by Rui Wang(Intrinsic ID), Roel Maes(Intrinsic ID) and Manil Dev Gomony(TU/e & Nokia Bell Labs).
  • [2022.09]  🎉🎉 I started my master's study at Eindhoven University of Technology (TU/e), The Netherlands.
  • [2022.07]  🎉🎉 I am graduated from Hefei University of Technology with a bachelor degree, supervised by Zhenmin Li.

📝 Publications

SOCC 2025
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LinkBo: a Single-Wire, Low-Latency, and Robust Protocol for Variable-Distance Chip-to-Chip Communications

Bochen Ye(TU/e & NXP), Gustavo Naspolini (NXP), Kimmo Salo (NXP), Manil Dev Gomony (TU/e)

IEEE International System-on-Chip Conference (SOCC), 2025

Selected as Oral Presentation and Student Contest

Paper/Slides/Poster/ArXiv(Full Version)/Website

We propose LinkBo, a single-wire communication protocol with dedicated hardware architecture, designed to achieve low latency (50.4 µs), high throughput (up to 7.5 Mbps @ 11 cm and 300 kbps @ 15 m), and robust priority-aware delivery.

This poster presents an automated design space exploration framework for dataflow systolic GenAI accelerators, aiming to identify the optimal hardware architecture for diverse workloads under given resource budgets.

Slides/Poster/Website –>

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🏫 Educations

2025.01-Now, University of Edinburgh, United Kingdom

2022.09-2024.11, Eindhoven University of Technology, The Netherlands

  • Msc.Eletrical Engneering(track:Electronic System)
  • GPA: 7.8/10
  • Relevant Course: Digital integrated circuit design, Embedded computer architecture, Electronic design automation, Applied combinatorial algorithms, Intelligent architectures(focus on DNN/Hardware co-design), Systems on silicon(focus on SoC backend), Neuro computation(focus on Neuromorphic computing).
  • Thesis: LinkBo: A Robust Low-Latency 1-Wire Protocol for Chip-to-Chip Communications (8.5/10)

2018.09 - 2022.07, Hefei University of Technology, China

💻 Internships

2024.03 - 2024.10, NXP Semidocutors, Nijmegen NL

  • Digital Design Intern

    I am working in AA-APS, this thesis project supervised by Kimmo Salo(NXP), Gustavo Naspolini(NXP), and Manil Dev Gomony(Bell Lab & TU/e). My work as follow:

    • Define a custom 1-wire digital communication protocol between two ICs.
    • Develope high-level model in Simulink and test the channel model with parasitic parameter.
    • Develop and verify an IP module implementing the new communication protocol using SystemVerilog.
    • Use Cadence Xcelium to simulate, Cadence SimVision to see the wave, Cadence Conformal Lint to lint and DesignSync to verision control.
    • Build a prototype demonstrator with 2 FPGAs.

2023.11 - 2024.06, Linear Capital, China (Remote Part-time)

  • Oversea VC Intern

    During my internship at Linear Capital, my responsibilities included:

    • Mapping overseas talent in the academic and industrial sectors, providing vital insights for project recruitment and business collaborations.
    • Conducting assessments for the commercialization and implementation of potential projects, analyzing market opportunities and risks to support investment decisions.
    • Participating in the planning and execution of early-stage investments, collaborating with startups to drive project success.

2023.07 - 2023.10, Intrinsic ID(Now acquired by Synopsys), Eindhoven NL

  • IP Modeling and Digital IC Design Intern

    I worked in Research and Security Department(now SoC Security of Synopsys). This internship supervised by Manil Dev Gomony(Bell Lab & TU/e) and Rui Wang & Roel Maes(Intrinsic ID). My work as follow:

    • Study on a trellis-based Reed-Muller codec.(Algorithm)
    • Use Python modeling it as a digital IP module.(software)
    • Design the architecture of codec and implementation by VHDL.(harware)
    • Verify on Arty-z7 FPGA(zynq) with vivado and vitis.(Embeded System)
    • Under the 50MHz condition, after several improvements, the hardware resource consumption decreased from 938 LUTs to 843 LUTs. Meanwhile, the decoding latency reduced to 6 clock cycles, and continuous decoding became possible.

🎖 Honors and Awards

  • IEEE CAS Student Travel Grant, SOCC 2025
  • Unergraduate Scholarship 2021/2022

📖 Skill

  • Professional: Verilog/SystemVerilog/VHDL · FPGA · Lint · Linux · Cadence Tool(Xcelium,SimVision,Conformal Lint,Virtuoso,Genus,Innovus)
  • Miscellaneous: Python · C/C++ · SystemC · MATLAB/Simulink · LaTex · CUDA · Pytorch · Perl/TCL/Shell · Git
  • Language: Mandarian(Native), English